PCB Design Course

Lesson 1 • PCB Design Workflow Overview

Maps the complete design cycle from concept to manufactured board. Connects each phase to deliverables expected by fabricators.

Lesson 2 • What Is a Printed Circuit Board

Defines PCB structure, materials, and functional purpose in electronics. Establishes vocabulary used throughout the course.

Lesson 3 • Introduction to EDA Software

Surveys electronic design automation tools and their core modules. Students select and configure a tool for use in subsequent chapters.

Lesson 1 • Drawing Nets and Connections

Teaches wire placement, net labels, and bus notation for clear signal routing. Proper net naming ensures correct PCB connectivity.

Lesson 2 • Component Annotation and Properties

Assigns reference designators, values, and metadata to every component. Consistent annotation feeds accurate bills of materials.

Lesson 3 • Schematic Symbols and Libraries

Covers standard symbol conventions and library sourcing for common components. Accurate symbols prevent netlist errors downstream.

Lesson 1 • Creating Custom Footprints

Guides students through building footprints from component datasheets. Custom footprints fill gaps in standard libraries.

Lesson 2 • Footprint Standards and Conventions

Explains land pattern standards for surface-mount and through-hole components. Correct pad dimensions ensure reliable solder joints.

Lesson 3 • 3D Models and Visual Verification

Attaches 3D models to footprints for mechanical clearance checks. Visual inspection catches height and orientation conflicts early.

Lesson 1 • Component Placement Strategy

Teaches systematic placement based on signal flow, thermal, and assembly needs. Good placement reduces routing complexity and EMI.

Lesson 2 • Board Setup and Design Rules

Configures board outline, layer stack, and minimum design rules before placement. Correct setup prevents rule violations throughout layout.

Lesson 3 • Ratsnest and Airwire Management

Uses ratsnest visualization to guide placement decisions and minimise crossings. Reducing airwire crossings simplifies subsequent routing.

Lesson 1 • High-Speed Signal Routing Rules

Introduces length matching, differential pairs, and return path continuity. These rules prevent signal integrity issues in fast digital designs.

Lesson 2 • Manual Routing Fundamentals

Covers trace placement, width selection, and corner styles for reliable connections. Manual routing builds intuition for signal behaviour on copper.

Lesson 3 • Power and Ground Routing

Addresses wide trace and plane strategies for low-impedance power distribution. Solid power routing reduces voltage drop and noise.

Lesson 4 • Interactive and Autorouting Tools

Demonstrates push-and-shove routing and autorouter configuration for efficiency. Autorouting supplements but does not replace manual critical-net routing.

Lesson 1 • Decoupling and Power Integrity

Covers capacitor selection, placement, and plane design for stable power delivery. Poor power integrity causes logic errors and EMI emissions.

Lesson 2 • EMC Layout Strategies

Applies shielding, filtering, and layout zoning to reduce radiated and conducted emissions. EMC compliance is required for most commercial products.

Lesson 3 • Signal Integrity Concepts

Explains reflection, crosstalk, and impedance mismatch as layout-driven phenomena. Understanding these effects motivates controlled-impedance design.

Lesson 1 • Design for Manufacturability Review

Evaluates layout against fabrication and assembly process capabilities. DFM review reduces scrap, rework, and first-article failures.

Lesson 2 • Assembly Drawing and BOM

Produces pick-and-place files, assembly drawings, and bills of materials for contract assembly. Complete assembly packages reduce quoting errors and rework.

Lesson 3 • Drill Files and Board Stackup Docs

Creates Excellon drill files and stackup drawings that define hole sizes and layer construction. Accurate drill data is critical for via and component hole quality.

Lesson 1 • RF and Analogue Layout Techniques

Addresses coplanar waveguide, ground stitching, and component placement for RF circuits. RF layout errors cause impedance mismatch and spurious emissions.

Lesson 2 • Thermal Management in Layout

Designs thermal vias, copper pours, and heatsink footprints for power dissipation. Inadequate thermal design causes component failure and derating.

Lesson 3 • Design Reuse and Modular Layout

Creates reusable layout blocks and templates to accelerate future projects. Modular design reduces errors and shortens design cycles.

Lesson 4 • High-Density Interconnect Design

Covers microvias, via-in-pad, and fine-pitch routing for HDI boards. HDI techniques enable compact designs with high component density.