Electronic Assembly and Wiring Agent Course

Lesson 1 • Electronic Components and Their Functions

Covers resistors, capacitors, diodes, transistors, and ICs with their roles in circuits. Establishes component literacy needed throughout all assembly tasks.

Lesson 2 • Electrical Safety and Hazard Awareness

Covers shock hazards, lockout/tagout procedures, and fire risks from solder fumes and flux. Safety compliance is a prerequisite for all hands-on lab work.

Lesson 3 • Electrostatic Discharge Prevention

Explains ESD damage mechanisms and introduces wrist straps, mats, and ionizers. Proper ESD control is mandatory before handling any sensitive components.

Lesson 4 • Workspace Setup and Ergonomics

Defines proper bench layout, lighting, magnification, and ergonomic posture for sustained precision work. Directly reduces fatigue-related assembly errors.

Lesson 1 • Through-Hole Soldering Fundamentals

Teaches component insertion, heat application sequence, and solder feed for through-hole joints. Forms the baseline technique before advancing to surface-mount work.

Lesson 2 • Soldering Iron Selection and Maintenance

Covers iron wattage, tip geometry, and temperature control for different joint types. Proper tool selection directly determines joint quality and tip longevity.

Lesson 3 • Solder Alloys and Flux Chemistry

Explains lead-free and tin-lead alloys, flux types, and their impact on wetting and residue. Alloy and flux selection affects joint reliability and cleaning requirements.

Lesson 4 • Surface-Mount Hand Soldering

Covers drag soldering, tack-and-reflow, and fine-pitch IC soldering with flux application. Builds on through-hole skills to address the dominant modern assembly format.

Lesson 1 • Component Placement Techniques

Teaches manual and semi-automated pick-and-place, polarity verification, and placement pressure. Accurate placement prevents tombstoning, bridging, and misalignment defects.

Lesson 2 • Reflow Soldering Profiles

Explains preheat, soak, reflow, and cooling zones and their effect on joint formation. Profile optimization reduces voiding, tombstoning, and thermal damage.

Lesson 3 • Post-Assembly Cleaning Processes

Addresses aqueous, semi-aqueous, and solvent cleaning methods for flux residue removal. Cleaning choice depends on flux type, board density, and end-use environment.

Lesson 4 • Wave and Selective Soldering

Covers flux application, preheat, and wave contact for through-hole mass soldering. Selective soldering extends wave principles to mixed-technology boards.

Lesson 1 • Splicing and Inline Connections

Covers Western Union, lap, and heat-shrink splice methods for field and production repairs. Splice selection depends on mechanical stress, environment, and current load.

Lesson 2 • Crimping Connectors and Terminals

Covers crimp tool selection, die sizing, and pull-force verification for insulated and non-insulated terminals. Crimping is the primary termination method in harness assembly.

Lesson 3 • Wire Stripping and Cutting Techniques

Teaches thermal, mechanical, and laser stripping methods with nick-free conductor preservation. Proper stripping is the foundation of every reliable termination.

Lesson 4 • Wire Soldering to Terminals and Pads

Applies hand soldering skills to wire-to-terminal and wire-to-pad joints with tinning and heat management. Builds on PCB soldering techniques for harness-to-board connections.

Lesson 1 • Wire Routing and Formboard Use

Covers formboard pin placement, wire routing sequence, and branch point management for consistent harness geometry. Formboard discipline ensures dimensional repeatability.

Lesson 2 • Connector Assembly and Backshell Installation

Covers contact insertion, retention verification, and backshell torque for multi-pin connectors. Correct connector assembly ensures mating reliability and environmental sealing.

Lesson 3 • Harness Design Interpretation

Teaches harness drawings, wire lists, and formboard layouts for accurate build execution. Drawing interpretation prevents mis-routing and incorrect connector pinouts.

Lesson 4 • Harness Continuity and Insulation Testing

Applies continuity testers and insulation resistance meters to verify harness electrical integrity. Testing confirms correct wiring before installation and prevents field failures.

Lesson 1 • Enclosure Sealing and Environmental Protection

Covers gasket installation, cable gland selection, and IP rating requirements for sealed enclosures. Environmental protection is critical for outdoor and industrial deployments.

Lesson 2 • Chassis Grounding and Bonding

Explains chassis ground points, bonding straps, and star grounding topology for noise and safety. Grounding errors cause EMI, shock hazards, and signal integrity problems.

Lesson 3 • PCB and Component Mounting

Teaches PCB standoff installation, conformal coating clearance, and heat sink attachment for chassis mounting. Proper mounting prevents stress fractures and thermal issues.

Lesson 4 • Panel Wiring and Dress

Covers wire routing from panel components to internal PCBs with service loops and strain relief. Neat wire dress improves serviceability and reduces vibration-induced failures.

Lesson 1 • X-Ray Inspection for Hidden Joints

Covers X-ray imaging of BGA, QFN, and hidden solder joints for void and bridging detection. X-ray inspection addresses defects invisible to optical methods.

Lesson 2 • Automated Optical Inspection Basics

Explains AOI system operation, programming, and false-call management for high-volume inspection. AOI complements visual inspection by providing consistent, repeatable coverage.

Lesson 3 • Defect Documentation and Corrective Action

Teaches nonconformance reporting, root cause analysis, and corrective action tracking for assembly defects. Systematic documentation drives process improvement and prevents recurrence.

Lesson 4 • Industry Workmanship Standards Overview

Introduces internationally recognized workmanship standards for soldering, wiring, and assembly. Understanding standard structure enables consistent accept/reject decisions.

Lesson 1 • Rework, Repair, and Retest Workflow

Integrates rework skills with retesting protocols to confirm fault resolution and assembly integrity. Structured retest prevents shipping repaired assemblies with residual defects.

Lesson 2 • Test Equipment Operation

Covers multimeter, oscilloscope, and power supply operation for assembly verification. Correct instrument use is the prerequisite for all functional and diagnostic testing.

Lesson 3 • Signal Tracing and Circuit Analysis

Applies oscilloscope and logic probe techniques to trace signals through functional blocks. Signal tracing isolates faults to specific stages before component-level diagnosis.

Lesson 4 • Component-Level Fault Diagnosis

Covers in-circuit resistance, diode, and transistor testing to identify failed components. Component-level diagnosis follows stage isolation and precedes targeted rework.