
PCB Maintenance Course
Master every stage of PCB maintenance, from reading schematics and using test equipment to advanced BGA rework and conformal coating. This course gives electronics technicians the hands-on skills and systematic methods needed to diagnose faults fast and repair boards right the first time. Build the technical confidence that keeps equipment running and repair costs down.
What your team will master:
You will learn how to read schematics, identify component packages, and use instruments including multimeters, oscilloscopes, LCR meters, and thermal cameras to locate faults accurately. The course covers hand-soldering and hot-air rework for both through-hole and surface-mount components, including fine-pitch ICs and BGA devices. You will apply structured troubleshooting frameworks to reduce diagnostic time on any board failure. Cleaning procedures, conformal coating selection, and ionic contamination testing are covered in full. You will also build skills in preventive maintenance programme design, repair documentation, and quality standards that align with industry workmanship requirements.
How your team learns practically PCB Maintenance Course
How your team practises PCB Maintenance Course
Professionals from these companies study at Dedika









Course content
8 Chapters • 40 LessonsDuration between 4 and 360 hours (you decide)
Chapter 1HideHide detailsSee detailsFoundations of PCB Technology
Foundations of PCB Technology
Lesson 1 • Component Categories and Packaging
Identifies through-hole and surface-mount component families and their package types. Provides the component literacy needed for diagnosis and repair tasks.
Lesson 2 • Workplace Safety and ESD Control
Establishes electrostatic discharge risks, personal protective equipment, and safe handling protocols. Prevents damage before any hands-on work begins.
Lesson 3 • PCB Materials and Substrates
Examines substrate materials, copper weights, and surface finishes. Connects material properties to failure modes addressed in later chapters.
Lesson 4 • Reading Schematics and PCB Layouts
Teaches schematic symbols, reference designators, and layout views. Enables technicians to trace circuits and locate components on physical boards.
Lesson 5 • PCB Types and Layer Structures
Covers single-sided, double-sided, and multilayer boards and their construction logic. Establishes the structural vocabulary used throughout the course.
Chapter 2HideHide detailsSee detailsTest Equipment and Measurement Techniques
Test Equipment and Measurement Techniques
Lesson 1 • Power Supply and Load Testing
Demonstrates bench power supply use for controlled board power-up and current monitoring. Identifies short circuits and excessive current draw safely.
Lesson 2 • Digital Multimeter Mastery
Covers all multimeter functions relevant to PCB work, including diode and continuity modes. Forms the measurement baseline for all subsequent diagnostic chapters.
Lesson 3 • LCR Meters and Component Analyzers
Explains in-circuit and out-of-circuit measurement of passive components. Supports accurate component verification before and after repair.
Lesson 4 • Thermal Imaging and Infrared Tools
Introduces thermal cameras and contact thermometers for locating hot components. Bridges electrical measurement with physical fault localization.
Lesson 5 • Oscilloscope Operation for PCB Work
Teaches oscilloscope setup, triggering, and waveform interpretation on live boards. Enables signal-level diagnosis beyond what a multimeter can reveal.
Chapter 3HideHide detailsSee detailsSoldering Skills and Hand Tools
Soldering Skills and Hand Tools
Lesson 1 • Surface-Mount Hand-Soldering
Covers drag soldering, tack-and-reflow, and fine-pitch IC hand placement. Builds the precision skills required for SMD repair and rework.
Lesson 2 • Solder Alloys and Flux Chemistry
Explains leaded and lead-free alloys, flux types, and their effect on joint quality. Correct material selection is critical for reliable and compliant repairs.
Lesson 3 • Soldering Iron Selection and Setup
Covers tip types, temperature settings, and station calibration for different joint sizes. Proper setup prevents thermal damage and poor joint quality.
Lesson 4 • Through-Hole Soldering Techniques
Teaches correct heat application, solder feed, and joint inspection for through-hole parts. Establishes the manual dexterity baseline for surface-mount work.
Lesson 5 • Joint Inspection and Quality Standards
Applies industry workmanship standards to evaluate solder joint acceptability. Connects visual inspection criteria to the rework decisions covered next.
Chapter 4HideHide detailsSee detailsFault Diagnosis and Troubleshooting Methods
Fault Diagnosis and Troubleshooting Methods
Lesson 1 • Visual Inspection Techniques
Teaches systematic board inspection for physical defects before applying power. Catches obvious faults early and guides subsequent electrical testing.
Lesson 2 • Structured Troubleshooting Frameworks
Introduces divide-and-conquer, signal-tracing, and symptom-based diagnostic models. Provides a repeatable mental framework for approaching any board failure.
Lesson 3 • Power Rail and Signal Path Analysis
Maps voltage rails and signal paths to locate faults in power distribution and logic. Connects measurement skills from Chapter 2 to real fault scenarios.
Lesson 4 • Fault Documentation and Root Cause Analysis
Establishes practices for recording findings, root causes, and corrective actions. Supports quality systems and prevents repeat failures on the same board.
Lesson 5 • In-Circuit Component Testing
Applies multimeter and LCR meter techniques to test components without full removal. Speeds diagnosis by narrowing suspect components before desoldering.
Chapter 5HideHide detailsSee detailsComponent Removal and Replacement
Component Removal and Replacement
Lesson 1 • SMD Component Removal with Hot Air
Teaches hot-air rework station setup and nozzle selection for SMD removal. Correct airflow and temperature profiles protect adjacent components. NO_CHANGES
Lesson 2 • Land Pad Repair and Restoration
Restores lifted, damaged, or missing pads using epoxy, copper tape, and jumper wires. Ensures a reliable solder surface before placing replacement components.
Lesson 3 • BGA and QFN Removal Techniques
Addresses infrared and hot-air reflow methods for area-array packages. These high-risk operations require precise thermal profiling to avoid board delamination.
Lesson 4 • Through-Hole Component Removal
Covers desoldering pump, wick, and vacuum desoldering station use for through-hole parts. Prevents pad and barrel damage during removal operations.
Lesson 5 • Component Placement and Soldering
Covers alignment, tacking, and final soldering of replacement components to specification. Completes the repair cycle started with removal and pad restoration.
Chapter 6HideHide detailsSee detailsPCB Cleaning and Conformal Coating
PCB Cleaning and Conformal Coating
Lesson 1 • Conformal Coating Types and Selection
Compares acrylic, silicone, polyurethane, and epoxy coatings by protection level and repairability. Correct selection balances environmental protection with future rework access.
Lesson 2 • Coating Inspection and Repair
Uses UV light and visual inspection to verify coating coverage and detect defects. Teaches localized coating removal for rework access and recoating after repair.
Lesson 3 • Coating Application Methods
Covers brush, spray, dip, and selective coating application techniques. Consistent coverage thickness prevents voids and pooling that reduce protection.
Lesson 4 • Ionic Contamination Testing
Explains resistivity-of-solvent-extract testing and ion chromatography for cleanliness verification. Quantifies contamination levels against accepted cleanliness thresholds.
Lesson 5 • Flux Residue and Contamination Removal
Identifies flux residue types and selects appropriate solvents and cleaning methods. Residue left on boards causes corrosion and leakage current failures.
Chapter 7HideHide detailsSee detailsAdvanced Rework: BGA and Fine-Pitch Devices
Advanced Rework: BGA and Fine-Pitch Devices
Lesson 1 • Fine-Pitch IC and QFN Rework
Addresses stencil printing, placement, and reflow for fine-pitch QFP and QFN packages. Thermal and alignment precision requirements exceed standard SMD rework.
Lesson 2 • Thermal Profiling for Rework
Develops rework thermal profiles using thermocouple data and reflow curve analysis. Correct profiling prevents cold joints, delamination, and component damage.
Lesson 3 • BGA Reballing and Site Preparation
Covers solder ball removal, pad cleaning, and reballing using stencils and preforms. Proper site preparation is the foundation of a reliable BGA replacement.
Lesson 4 • BGA Placement and Reflow
Teaches X-ray-guided placement, flux deposition, and controlled reflow for BGA devices. Precise alignment and thermal control determine joint reliability.
Lesson 5 • Post-Rework Verification and Reliability
Applies X-ray, cross-section analysis, and functional testing to confirm rework quality. Validates that reworked assemblies meet original reliability requirements.
Chapter 8HideHide detailsSee detailsPreventive Maintenance and Quality Systems
Preventive Maintenance and Quality Systems
Lesson 1 • Calibration and Tool Qualification
Covers calibration schedules, records, and out-of-tolerance response for maintenance tools. Calibrated tools ensure measurement accuracy and process repeatability.
Lesson 2 • Continuous Improvement in Maintenance
Introduces defect Pareto analysis, corrective action processes, and process capability metrics. Drives measurable reduction in repeat failures and repair cycle time.
Lesson 3 • Quality Standards and Workmanship Criteria
Applies industry workmanship standards to define acceptance criteria for repaired assemblies. Aligns maintenance output with original manufacturing quality expectations.
Lesson 4 • Maintenance Documentation and Traceability
Establishes work order systems, repair logs, and component traceability records. Documentation supports warranty claims, audits, and failure trend analysis.
Lesson 5 • Preventive Maintenance Program Design
Defines inspection intervals, cleaning schedules, and component replacement cycles for fielded boards. Structured PM programmes reduce unplanned downtime and repair costs.
Your valid completion certificate
This course is for you:
Electronics technician: wants to move beyond basic repairs into board-level work.
Field service engineer: needs reliable methods to diagnose failures on-site fast.
Hobbyist maker: ready to repair and restore real hardware beyond simple projects.
Manufacturing quality inspector: seeking deeper repair context behind workmanship standards.
Career changer: transitioning into electronics maintenance from a related technical trade.
Military or industrial equipment maintainer: responsible for keeping mission-critical boards operational.
Related Courses
FAQs
Who is Dedika?
Is the certificate valid in India?
Are the courses free?
What is the course workload?
What are the courses like?
How do the courses work?
What is the duration of the courses?
What is the cost or price of the courses?
What is an EAD or online course and how does it work?
PDF Course



















