SMD Soldering Course

Lesson 1 • PCB Anatomy for SMD Work

Explains PCB layers, pad geometry, solder mask, and silkscreen as they relate to SMD assembly. Provides the vocabulary needed for all subsequent soldering and inspection tasks.

Lesson 2 • Datasheets and Component Specifications

Teaches how to extract soldering-relevant data from manufacturer datasheets. Students locate land patterns, thermal ratings, and reflow profiles for any given component.

Lesson 3 • SMD Component Types and Packages

Identifies passive and active SMD components and their standard package designations. Connects component recognition to correct handling and placement techniques.

Lesson 1 • Auxiliary Tools and Consumables

Introduces desoldering tools, tweezers, PCB holders, and cleaning supplies used in SMD work. Proper tool selection reduces component damage and rework time.

Lesson 2 • ESD Safety and Workspace Organization

Establishes electrostatic discharge prevention practices and ergonomic workspace layout. Students configure a compliant ESD-safe bench before beginning any soldering practice.

Lesson 3 • Soldering Irons and Temperature Stations

Covers iron types, tip geometries, and temperature control for SMD work. Students match tip selection to component package size and thermal mass.

Lesson 1 • Solder Paste Properties and Handling

Explains paste viscosity, particle size, and shelf-life requirements critical to print quality. Correct handling prevents voids, bridging, and poor reflow results.

Lesson 2 • Paste Inspection and Defect Recognition

Identifies common paste printing defects and their root causes. Students use visual and 2D inspection methods to accept or reject prints before component placement.

Lesson 3 • Manual Stencil Printing Technique

Teaches board registration, squeegee angle, speed, and pressure for consistent paste prints. Students practice the print-inspect-clean cycle to achieve repeatable results.

Lesson 1 • Placement Accuracy and Alignment

Covers acceptable placement tolerances for various package types and self-alignment during reflow. Students evaluate placement quality against industry acceptance standards.

Lesson 2 • Vacuum Pickup Tools and Nozzles

Introduces manual vacuum pens and nozzle selection for larger SMD packages. Students match nozzle size to component body and practice controlled placement.

Lesson 3 • Tweezer Technique and Component Handling

Builds hand control for picking, orienting, and placing SMD components without damage. Proper grip and release technique prevents component loss and ESD events.

Lesson 1 • Reflow Defect Identification and Causes

Identifies tombstoning, bridging, solder balls, and cold joints produced by reflow errors. Students trace each defect to its root cause in paste, placement, or profile.

Lesson 2 • Reflow Profile Zones and Theory

Explains preheat, soak, reflow, and cooling zones and their metallurgical effects. Students connect profile parameters to joint quality and component survival.

Lesson 3 • Benchtop Reflow Oven Operation

Covers profile programming, board loading, and process monitoring for benchtop reflow ovens. Students program and validate a lead-free reflow profile for a mixed-component board.

Lesson 4 • Hot Air Rework Station Technique

Teaches airflow, temperature, and nozzle selection for hot air reflow of SMD components. Students reflow individual components and small boards without disturbing adjacent parts.

Lesson 1 • Soldering Passive Components

Covers tack-soldering one end, aligning, and completing the joint for 0402 to 1206 passives. Students achieve consistent fillet geometry on both pads of each component.

Lesson 2 • Soldering QFP and Fine-Pitch ICs

Teaches tack, flux, and drag techniques for QFP packages with 0.5 mm and 0.65 mm pitch leads. Students achieve bridge-free joints on all four sides of a QFP.

Lesson 3 • Soldering SOT and Small IC Packages

Applies hand soldering to SOT-23, SOT-223, and small SOIC packages with multiple leads. Students manage lead pitch and solder volume to avoid bridging.

Lesson 1 • Removing Passive and SOT Components

Teaches simultaneous heating of both pads to remove passives and SOT devices cleanly. Students clear pads of excess solder and prepare them for replacement components.

Lesson 2 • Pad Repair and PCB Restoration

Covers lifted pad repair, trace repair, and via restoration after rework damage. Students apply conductive epoxy and copper tape techniques to restore board functionality.

Lesson 3 • Rework Planning and Board Preparation

Covers damage assessment, adjacent component protection, and flux application before rework. Proper preparation prevents collateral damage and improves rework success rates.

Lesson 4 • BGA Removal and Reballing

Introduces BGA removal using infrared or hot air preheating and controlled top-side heating. Students remove BGA devices and reball them using stencil and solder spheres.

Lesson 1 • Defect Root-Cause Analysis

Applies structured root-cause methods to recurring SMD soldering defects. Students trace defects to process, material, or equipment variables and propose corrective actions.

Lesson 2 • Industry Acceptance Standards for SMD

Introduces workmanship classes and acceptance criteria for SMD solder joints from recognized industry standards. Students classify joints as acceptable, process indicator, or defect.

Lesson 3 • Process Control and Continuous Improvement

Introduces statistical process control concepts applied to SMD soldering yield and defect rates. Students track key metrics and use data to drive process improvements.

Lesson 4 • Visual and Optical Inspection Techniques

Covers unaided eye, stereo microscope, and digital microscope inspection methods for SMD joints. Students identify and classify defects using proper lighting and magnification.