Mobile Phone Circuit Board Course

Lesson 1 • Electrostatic Discharge Prevention

Explains how ESD damages ICs and outlines protective measures. Correct grounding habits are established before any hands-on board work begins.

Lesson 2 • Microscopy and Inspection Tools

Introduces stereo microscopes, digital microscopes, and UV inspection lamps. Students inspect solder joints and trace damage at the microscopic level.

Lesson 3 • Soldering Station Equipment

Covers hot-air rework stations, soldering irons, and temperature control. Students select correct tip profiles and temperature settings for mobile work.

Lesson 4 • Mechanical Disassembly Tools

Covers spudgers, opening picks, precision screwdrivers, and pry tools. Students disassemble a device without scratching housings or tearing flex cables.

Lesson 1 • Smartphone Architecture Overview

Maps the logical relationship between hardware subsystems and the PCB. Establishes the vocabulary used throughout the entire course.

Lesson 2 • Connectors, Flex Cables, and Interfaces

Examines board-to-board connectors, flex cable interfaces, and port connectors. Prepares students for safe disassembly and reassembly procedures.

Lesson 3 • Reading Schematics and Board Views

Introduces schematic symbols and board-view software used in professional repair. Students locate any component on a real board using these tools.

Lesson 4 • Core Components and Their Functions

Identifies the application processor, memory, and power management IC by sight and function. Connects each component to its role in device operation.

Lesson 1 • Fault Isolation Methodology

Presents a structured divide-and-conquer approach to narrowing fault location. Students apply a repeatable diagnostic flowchart to any dead or misbehaving device.

Lesson 2 • Digital Multimeter Mastery

Covers voltage, resistance, continuity, and diode-mode measurements on live boards. Students interpret readings to locate open circuits and short circuits.

Lesson 3 • Power Supply and Current Injection

Uses a bench power supply to power boards safely and observe current draw. Students identify short-circuit locations by monitoring current spikes.

Lesson 4 • Using Diagnostic Software and Jigs

Covers test jigs, boot-mode triggers, and PC-based diagnostic software. Students extract error codes and logs to confirm hardware fault locations.

Lesson 1 • BGA Reballing and Replacement

Introduces BGA ball removal, stencil reballing, and controlled reflow. Students reball a memory or baseband chip to professional standards.

Lesson 2 • Jumper Wires and Pad Repair

Covers lifted-pad repair, trace cutting, and fine-wire jumper installation. Students restore broken circuit paths using professional micro-wire techniques.

Lesson 3 • Solder Joint Theory and Standards

Explains wetting, intermetallic bonding, and industry-standard joint acceptance criteria. Students distinguish acceptable joints from defects before picking up a tool.

Lesson 4 • Hot-Air Rework for SMD ICs

Teaches airflow, temperature profiles, and nozzle selection for IC removal. Students remove and replace QFN, BGA-adjacent, and shielded ICs cleanly.

Lesson 1 • Battery and Charging Circuit Fundamentals

Explains lithium-ion cell chemistry, protection circuits, and charge management ICs. Students test battery health and trace charging current paths on the board.

Lesson 2 • Short-Circuit Fault Diagnosis

Applies current injection and thermal imaging to locate shorted rails. Students isolate the faulty component causing a power short without board damage.

Lesson 3 • Charging Port and USB Power Delivery

Covers USB power delivery negotiation, port IC faults, and connector replacement. Students restore charging function on devices with damaged port assemblies.

Lesson 4 • Power Management IC Operation

Details PMIC internal regulators, buck converters, and LDO outputs. Students map every rail generated by the PMIC using schematics and a multimeter.

Lesson 1 • Touch Controller Diagnosis

Covers I2C communication between the AP and touch IC, plus power rail checks. Students restore touch function by repairing the controller or its support components.

Lesson 2 • Display Interface and Driver Circuits

Explains MIPI DSI protocol, display driver ICs, and backlight boost circuits. Students trace display signals from the AP to the connector and isolate faults.

Lesson 3 • Vibration Motor and Haptic Circuits

Examines motor driver ICs and haptic feedback controllers on the board. Students test drive signals and replace failed motor driver components.

Lesson 4 • Earpiece, Speaker, and Microphone Circuits

Traces audio signal paths from the audio codec to transducers and microphones. Students diagnose no-audio and distorted-audio faults at the component level.

Lesson 1 • Wi-Fi and Bluetooth Module Repair

Examines the combo Wi-Fi/BT chip, its power rails, and PCIe or SDIO interface. Students restore wireless connectivity by repairing the module and its support circuits.

Lesson 2 • RF Front-End Architecture

Maps the signal path from antenna to baseband through PA, switch, and filter. Students identify each RF component on the board and understand its function.

Lesson 3 • SIM Card Circuit Diagnosis

Traces SIM voltage, clock, data, and reset lines from the tray to the baseband. Students repair broken SIM circuits and replace damaged SIM card ICs.

Lesson 4 • GPS and NFC Circuit Repair

Covers GPS LNA power, antenna routing, and NFC controller interface circuits. Students diagnose and restore location and contactless payment functionality.

Lesson 1 • Multi-Fault and Intermittent Fault Cases

Develops strategies for boards with multiple simultaneous or intermittent failures. Students use stress testing and signal monitoring to expose hidden faults.

Lesson 2 • Quality Control and Professional Workflow

Establishes post-repair testing checklists, documentation standards, and warranty practices. Students deliver repairs that meet professional quality benchmarks consistently.

Lesson 3 • Liquid Damage Assessment and Recovery

Guides systematic inspection, cleaning, and component replacement after liquid ingress. Students recover boards that appear dead by following a structured triage protocol.

Lesson 4 • CPU and Memory Fault Diagnosis

Addresses AP, RAM, and storage chip failures including NAND and eMMC faults. Students determine whether chip-level replacement or data recovery is the correct path.