Video Card Repair Course

Lesson 1 • GPU Die and Core Structure

Covers shader clusters, render output units, and memory controllers inside the GPU die. Establishes the functional map technicians reference throughout all repair work.

Lesson 2 • Display Output and Signal Chain

Traces the signal path from framebuffer through TMDS/DisplayPort encoders to output connectors. Provides the baseline for diagnosing no-display and artifact faults.

Lesson 3 • Video Memory Types and Roles

Examines GDDR and HBM memory architectures, bus widths, and bandwidth implications. Connects memory specs to common failure symptoms observed during diagnosis.

Lesson 4 • Power Delivery Subsystem

Details VRM topology, inductors, capacitors, and MOSFETs that regulate GPU and memory voltages. Understanding this subsystem is prerequisite to all power-fault diagnosis.

Lesson 1 • Workspace Organization and Safety

Addresses fume extraction, lighting, anti-fatigue matting, and component organization. A well-organized bench reduces errors and protects technician health.

Lesson 2 • Measurement and Diagnostic Instruments

Covers multimeters, oscilloscopes, bench power supplies, and thermal cameras. Each instrument is matched to specific fault categories covered in later chapters.

Lesson 3 • Soldering and Rework Equipment

Introduces hot-air stations, soldering irons, infrared rework systems, and their calibration. Selecting the right tool for each joint type directly affects repair quality.

Lesson 4 • Chemical Supplies and Consumables

Details flux types, solder alloys, isopropyl alcohol, and thermal interface materials. Correct consumable selection prevents corrosion and ensures reliable joints.

Lesson 1 • Board View Software Usage

Introduces board view tools that overlay component locations on PCB images. Linking schematic nets to physical pads accelerates component location during repair.

Lesson 2 • Power Rail Mapping

Explains how to trace power rails from input connectors through VRMs to load points. Rail maps are the primary reference for voltage measurement sequences.

Lesson 3 • Schematic Symbol Conventions

Teaches resistor, capacitor, inductor, transistor, and IC symbols used in GPU schematics. Accurate symbol recognition is the entry point to all schematic-based diagnosis.

Lesson 4 • Signal Net Tracing Techniques

Covers net names, page cross-references, and bus notation for tracing data signals. Technicians apply these skills to locate open or shorted signal lines on the board.

Lesson 1 • Symptom Classification Framework

Categorizes faults as no-power, no-display, artifact, thermal, or intermittent. Classification directs the technician to the correct diagnostic branch immediately.

Lesson 2 • Voltage and Resistance Measurement

Details in-circuit resistance checks, diode mode testing, and live voltage measurement sequences. Measurements are interpreted against schematic reference values established in Chapter 3.

Lesson 3 • Thermal Fault Identification

Uses thermal cameras and freeze spray to locate hot spots and cold joints under load. Thermal data narrows fault location to a specific component or solder joint.

Lesson 4 • Visual Inspection Techniques

Covers macro and microscope inspection for burnt components, lifted pads, cracked solder, and corrosion. Visual findings often resolve diagnosis before any measurement is taken.

Lesson 1 • PWM Controller Diagnosis and Swap

Diagnoses failed PWM controllers by checking enable, feedback, and switching signals. Controller replacement restores phase switching when MOSFETs test good.

Lesson 2 • Post-Repair Power Validation

Defines the voltage measurement sequence and load test used to confirm full power system recovery. Validation data is recorded and compared against schematic reference values.

Lesson 3 • MOSFET Testing and Replacement

Covers in-circuit MOSFET testing, hot-air removal, pad cleaning, and replacement soldering. MOSFET failures are among the most frequent power-fault causes on modern cards.

Lesson 4 • Inductor and Capacitor Replacement

Addresses shorted inductors, failed bulk capacitors, and failed ceramic capacitors in VRM circuits. Passive component replacement restores ripple performance and rail stability.

Lesson 1 • BGA Placement and Reflow

Covers optical alignment, flux application to pads, chip placement, and final reflow cycle. X-ray or dye-and-pry testing confirms joint quality after reflow.

Lesson 2 • BGA Removal Techniques

Demonstrates infrared and hot-air BGA removal with board preheating and chip lifting. Controlled removal preserves pad integrity for subsequent reballing.

Lesson 3 • Thermal Profile Design

Covers preheat, soak, reflow, and cooling ramp rates for lead-free and leaded BGA profiles. Correct profiles prevent PCB delamination and ensure full ball reflow.

Lesson 4 • BGA Fundamentals and Failure Modes

Explains BGA ball composition, underfill types, and common failure modes including cracked balls and delamination. This context guides rework temperature profile selection.

Lesson 1 • Display Output IC Replacement

Covers removal and replacement of DisplayPort and HDMI output ICs using hot-air and stencil techniques. Correct IC orientation and pad preparation are verified before reflow.

Lesson 2 • Artifact Fault Diagnosis

Identifies artifact causes including memory errors, GPU core damage, and signal integrity issues. Artifact pattern analysis directs the technician to the correct repair action.

Lesson 3 • No-Display Fault Diagnosis

Traces the display signal chain from GPU encoder through output IC to connector to isolate no-display faults. Distinguishes GPU-side failures from output-stage component failures.

Lesson 4 • Video Memory Chip Replacement

Applies BGA rework skills from Chapter 6 to remove and replace failed GDDR memory chips. Memory bus termination resistors are inspected and replaced as needed.

Lesson 1 • Previously Repaired Card Assessment

Identifies signs of prior rework including pad damage, wrong components, and flux residue. Assessment findings determine whether the card is repairable or beyond economic repair.

Lesson 2 • Pad and Trace Repair Techniques

Covers lifted pad re-anchoring, trace jumper wiring, and via repair using conductive epoxy. These techniques recover boards that would otherwise be scrapped.

Lesson 3 • Multi-Fault Repair Sequencing

Teaches prioritization and sequencing when multiple independent faults are present on one card. Correct sequencing prevents masking secondary faults and reduces total repair time.

Lesson 4 • BIOS and Firmware Considerations

Addresses BIOS chip reading, flashing, and recovery for cards with corrupted or mismatched firmware. Correct firmware is required before final functional testing.