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Electroplating Course

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Chemistry

Electroplating Course

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Electroplating Course

Name: Electroplating Course
Price: 222 USD

Master every stage of the electroplating process, from bath chemistry and substrate preparation to defect analysis and process improvement. This course gives working platers, process engineers, and quality technicians the technical depth and practical tools to run tighter, more efficient plating operations. If you want fewer rejects, better deposits, and measurable results on the shop floor, this is your next step.

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What you will learn:

You will gain a solid grasp of electrochemical principles and learn to control the variables that affect deposit quality. The course covers substrate cleaning and activation, common plating bath chemistries—nickel, copper, zinc, chrome, and precious metals—and the equipment used to run them. You will develop hands‑on analytical skills for bath monitoring, Hull‑cell testing, and statistical process control. Defect identification and root‑cause analysis are covered in detail so you can solve problems quickly and prevent recurrence. Advanced topics include pulse plating, alloy deposition, automation, and selective plating techniques. Environmental compliance, safety management, and cost analysis complete the curriculum, enabling confident operation at every level.

How you study in practice Electroplating Course

How you practice Electroplating Course

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Course Content

8 Chapters • 39 LessonsDuration between 4 and 360 hours (you decide)

Chapter 1See details

Fundamentals of Electroplating Science

Lesson 1 • Electrochemistry Basics for Platers
Covers oxidation-reduction reactions, electrode potentials, and Faraday's laws. Establishes the scientific basis for all subsequent plating process decisions.
Lesson 2 • Metal Ion Deposition Mechanisms
Explains nucleation, crystal growth, and grain structure formation during deposition. Links deposition mechanism to final deposit properties.
Lesson 3 • Anatomy of a Plating Cell
Identifies anode, cathode, electrolyte, and power supply roles. Connects cell geometry to deposit uniformity and current distribution.
Lesson 4 • Key Plating Variables
Introduces temperature, pH, current density, and agitation as primary process controls. Demonstrates how each variable shifts deposit quality.

Chapter 2See details

Substrate Preparation and Surface Conditioning

Lesson 1 • Alkaline and Solvent Cleaning Methods
Covers soak cleaning, electrocleaning, and solvent degreasing chemistry and parameters. Connects cleaner selection to substrate material compatibility.
Lesson 2 • Contamination Types and Their Impact
Categorizes oils, oxides, smut, and scale as adhesion barriers. Understanding contamination type guides correct cleaning method selection.
Lesson 3 • Mechanical Surface Preparation
Addresses grinding, blasting, and polishing to achieve required surface finish before plating. Mechanical prep affects deposit leveling and appearance.
Lesson 4 • Adhesion Testing and Verification
Introduces bend, tape, and thermal shock tests to verify adhesion after preparation. Verification data feeds back into process adjustment decisions.
Lesson 5 • Acid Activation and Pickling
Explains acid pickling to remove oxides and activate metal surfaces before plating. Proper activation prevents blistering and poor adhesion.

Chapter 3See details

Common Plating Bath Chemistries

Lesson 1 • Nickel Plating Bath Systems
Covers Watts, sulfamate, and bright nickel bath compositions and operating parameters. Nickel is the most widely used undercoat and functional deposit.
Lesson 2 • Chromium Plating Bath Systems
Addresses decorative and hard chrome baths, including trivalent chrome alternatives. Chrome deposits provide hardness, wear resistance, and appearance.
Lesson 3 • Copper Plating Bath Systems
Explains acid copper sulfate, pyrophosphate, and cyanide copper bath chemistries. Copper is critical for leveling, conductivity, and undercoat applications.
Lesson 4 • Zinc and Zinc Alloy Plating
Covers alkaline non-cyanide, acid chloride, and zinc-nickel bath systems for corrosion protection. Zinc deposits are the dominant industrial corrosion barrier.
Lesson 5 • Precious Metal Plating Baths
Introduces gold, silver, and palladium bath formulations for electronics and jewelry. Precious metal baths require tight control due to high material cost.

Chapter 4See details

Equipment Selection and Operation

Lesson 1 • Filtration and Agitation Systems
Covers filter media, pump sizing, air agitation, and mechanical agitation methods. Filtration and agitation maintain bath clarity and deposit quality.
Lesson 2 • Rinsing Systems and Drag-Out Control
Explains single, counter-current, and spray rinse configurations for chemical recovery. Effective rinsing reduces contamination and lowers chemical consumption.
Lesson 3 • Anode Systems and Configurations
Addresses soluble versus insoluble anodes, anode bags, and anode placement geometry. Correct anode configuration ensures uniform current distribution.
Lesson 4 • Tank Design and Materials
Explains tank construction materials, lining options, and sizing for different bath chemistries. Tank design affects chemical compatibility, heat retention, and safety.
Lesson 5 • Rectifiers and Power Supply Systems
Covers DC rectifier types, pulse plating power supplies, and output waveform effects. Power supply selection directly controls deposit structure and efficiency.

Chapter 5See details

Bath Analysis and Chemical Control

Lesson 1 • Statistical Process Control for Baths
Applies control charts and trend analysis to bath chemistry data. SPC converts analytical data into proactive process adjustments.
Lesson 2 • Hull Cell Testing and Interpretation
Explains Hull cell geometry, test procedure, and panel evaluation for bath optimization. Hull cell results guide additive and parameter adjustments before production.
Lesson 3 • Wet Chemical Analysis Methods
Covers titration, gravimetric, and colorimetric methods for metal and additive analysis. Accurate wet analysis is the foundation of bath control.
Lesson 4 • Bath Maintenance and Replenishment
Covers addition calculations, carbon treatment, and dummy plating for bath upkeep. Systematic maintenance extends bath life and reduces defect rates.
Lesson 5 • Instrumental Analysis Techniques
Introduces atomic absorption, X-ray fluorescence, and ion chromatography for bath analysis. Instrumental methods provide speed and precision beyond wet chemistry.

Chapter 6See details

Deposit Quality and Defect Analysis

Lesson 1 • Deposit Thickness Measurement
Covers magnetic, eddy current, XRF, and cross-section methods for thickness verification. Thickness measurement confirms compliance with engineering specifications.
Lesson 2 • Mechanical Property Testing
Introduces hardness, tensile, and ductility tests for functional deposit evaluation. Mechanical properties determine suitability for wear, fatigue, and load applications.
Lesson 3 • Corrosion Performance Testing
Covers salt spray, CASS, and humidity testing to evaluate corrosion resistance. Corrosion test results validate coating system selection and thickness.
Lesson 4 • Visual and Microscopic Defect Identification
Trains recognition of pitting, burning, roughness, blistering, and skip plating. Visual identification is the first step in structured defect analysis.
Lesson 5 • Root Cause Analysis and Corrective Action
Applies fishbone diagrams and 5-Why analysis to plating defect investigations. Structured RCA prevents defect recurrence and drives process improvement.

Chapter 7See details

Process Improvement Methodologies

Lesson 1 • Design of Experiments for Plating
Introduces factorial and response surface designs to optimize plating parameters efficiently. DOE replaces one-factor-at-a-time trials with statistically valid experiments.
Lesson 2 • Lean Principles in Plating Operations
Applies value stream mapping and waste identification to plating line workflows. Lean tools reduce cycle time, inventory, and non-value-added handling.
Lesson 3 • Six Sigma DMAIC for Plating
Guides students through Define, Measure, Analyze, Improve, and Control phases for plating problems. DMAIC provides a data-driven framework for reducing defect rates.
Lesson 4 • Sustaining Improvements and Change Control
Covers control plans, standard operating procedures, and change management to lock in gains. Sustained improvement requires documented controls and operator engagement.
Lesson 5 • Key Performance Indicators and Metrics
Defines yield, first-pass quality, rework rate, and cost-per-part as plating KPIs. KPI tracking converts process data into actionable business intelligence.

Chapter 8See details

Advanced Plating Technologies and Strategies

Lesson 1 • Alloy Electrodeposition
Covers co-deposition principles for tin-lead, zinc-nickel, and cobalt alloy systems. Alloy deposits extend corrosion, wear, and solderability performance beyond single metals.
Lesson 2 • Pulse and Pulse-Reverse Plating
Explains waveform parameters, duty cycle, and frequency effects on deposit microstructure. Pulse plating enables finer grain, lower stress, and improved alloy control.
Lesson 3 • Automation and Process Control Systems
Covers programmable logic controllers, automated dosing, and robotic part handling in plating lines. Automation improves repeatability, reduces labor cost, and enables data capture.
Lesson 4 • Strategic Process Benchmarking
Applies competitive benchmarking and technology roadmapping to identify process upgrade priorities. Strategic analysis aligns plating investments with business and customer requirements.
Lesson 5 • Selective and Brush Plating
Introduces portable brush plating and masking techniques for localized deposit application. Selective plating reduces precious metal use and enables in-field repair.

Certification

Your valid completion certificate

This course is for you:

Plating line operator: wants to understand the science behind daily tasks.
Process engineer: needs structured methods to cut defect rates consistently.
Quality technician: seeks deeper knowledge to interpret test results confidently.
Maintenance technician: supports plating equipment and wants broader process context.
Manufacturing supervisor: oversees a plating department and wants to drive measurable gains.
Career changer: brings a chemistry or manufacturing background and is entering the plating field.

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