SMT Assembly Course

Lesson 1 • SMT Assembly Process Overview

Maps the end-to-end SMT line sequence from paste printing to final inspection. Establishes the process framework referenced throughout the course.

Lesson 2 • Industry Standards and Quality Frameworks

Introduces workmanship standards, acceptability criteria, and quality management concepts governing SMT production. Sets the quality baseline for all subsequent chapters.

Lesson 3 • SMT Component Types and Packages

Covers passive, active, and electromechanical SMT packages and their dimensional standards. Enables correct component identification on bills of materials.

Lesson 4 • PCB Substrate Basics

Introduces laminate materials, copper weights, and surface finishes used in SMT boards. Links substrate properties to solderability and thermal performance.

Lesson 1 • Flux Chemistry and Activity

Covers rosin, no-clean, and water-soluble flux chemistries and their activation mechanisms. Guides flux selection based on cleaning requirements and reliability targets.

Lesson 2 • Paste Storage and Handling Procedures

Defines refrigeration, warm-up, and working-life protocols to preserve paste performance. Prevents print defects caused by improper paste conditioning.

Lesson 3 • Paste Testing and Qualification

Introduces slump, tack, and print-performance tests used to qualify paste lots. Ensures incoming paste meets process specifications before production use.

Lesson 4 • Solder Alloy Composition

Explains tin-lead and lead-free alloy systems, melting points, and mechanical properties. Connects alloy choice to reflow profile and joint reliability.

Lesson 1 • Print Inspection and Process Control

Introduces 2D and 3D solder paste inspection metrics and statistical process control for printing. Enables early detection of print drift before placement begins.

Lesson 2 • Stencil Types and Fabrication Methods

Compares laser-cut, electroformed, and step stencils in terms of aperture wall quality and cost. Guides stencil selection for fine-pitch and mixed-technology boards.

Lesson 3 • Aperture Design Rules

Covers area ratio, aspect ratio, and aperture shape rules that govern paste release. Applies design rules to fine-pitch, BGA, and large-pad geometries.

Lesson 4 • Stencil Thickness Selection

Explains how stencil thickness affects paste volume, bridging risk, and component standoff. Provides a decision framework for mixed-component boards.

Lesson 1 • Component Library and Program Creation

Guides creation of accurate component libraries including vision parameters, nozzle assignments, and pick offsets. Accurate libraries are the foundation of first-pass placement yield.

Lesson 2 • Feeder Types and Management

Covers tape, tray, tube, and bulk feeders and their setup, splicing, and changeover procedures. Minimises placement stoppages caused by feeder errors.

Lesson 3 • Pick-and-Place Machine Architecture

Explains gantry, turret, and modular placement machine designs and their speed-accuracy trade-offs. Provides the mechanical foundation for setup and programming tasks.

Lesson 4 • Line Balancing and Throughput

Explains cycle time analysis, machine balancing, and feeder lane optimisation for maximum output. Reduces bottlenecks in multi-machine SMT lines.

Lesson 1 • Lead-Free and Mixed-Alloy Profiling

Addresses the narrower process window of SAC alloys and strategies for mixed tin-lead and lead-free boards. Prevents cold joints and component damage on complex assemblies.

Lesson 2 • Reflow Oven Technology

Compares convection, vapour-phase, and laser reflow methods in terms of heat transfer and application. Establishes the thermal basis for profile development.

Lesson 3 • Thermal Profile Zones and Parameters

Defines preheat, soak, reflow, and cooling zones and their temperature and time targets. Links each zone to flux activation, voiding, and intermetallic formation.

Lesson 4 • Reflow Defects and Corrective Actions

Identifies tombstoning, bridging, voiding, and head-in-pillow defects and their profile-related root causes. Enables systematic defect elimination through profile and process adjustment.

Lesson 1 • Visual and Manual Inspection

Covers magnification tools, lighting techniques, and workmanship criteria for manual solder joint evaluation. Establishes the baseline inspection skill before automated methods.

Lesson 2 • Inspection Data and Yield Analysis

Covers defects-per-million calculations, Pareto analysis, and first-pass yield tracking for continuous improvement. Transforms inspection data into actionable process improvements.

Lesson 3 • Automated Optical Inspection

Explains AOI system operation, programming, and false-call management for post-reflow inspection. Integrates AOI data into the process feedback loop.

Lesson 4 • X-Ray Inspection Techniques

Addresses 2D and 3D X-ray use for BGA, QFN, and hidden-joint inspection. Enables detection of voiding, bridging, and missing balls not visible optically.

Lesson 1 • Coating Inspection and Cure Verification

Covers UV fluorescence inspection, thickness measurement, and adhesion testing for cured coatings. Confirms coating integrity before final assembly shipment.

Lesson 2 • Conformal Coating Materials

Compares acrylic, polyurethane, silicone, and epoxy coatings by protection level and reworkability. Guides coating selection for moisture, chemical, and thermal environments.

Lesson 3 • Aqueous and Solvent Cleaning Processes

Covers inline aqueous, batch, and solvent cleaning systems, chemistries, and rinse validation. Selects the appropriate cleaning method for flux type and assembly geometry.

Lesson 4 • Coating Application Methods

Details selective spray, dip, and brush application techniques and masking strategies for keep-out areas. Achieves uniform coverage without contaminating connectors or test points.

Lesson 1 • Process Optimisation and DOE Methods

Introduces design of experiments, process capability indices, and FMEA for systematic SMT improvement. Enables data-driven decisions that reduce defects and increase throughput.

Lesson 2 • Rework Inspection and Validation

Applies visual, AOI, and X-ray inspection to verify reworked joints meet workmanship standards. Closes the rework loop with documented pass/fail records.

Lesson 3 • Component Removal Techniques

Covers removal procedures for QFP, BGA, QFN, and passive components using appropriate nozzles and profiles. Prevents pad and laminate damage during component extraction.

Lesson 4 • Site Preparation and Component Replacement

Details pad cleaning, flux application, and solder paste or ball placement before installing replacement parts. Ensures replacement joints meet the same quality standard as original assembly.